ESA Microelectronics Section

This page contains the slides presented during the fourth Edition of the Microelectronic Presentation Days, which took place at ESTEC from March 30th until April 1st, 2010.
The program of the event, with the detailed list of presentations, can be found here.  
 
1st Day - 30th of March 2010
 
  • ATC18RHA Multi-Project Wafer   Presenter: Dominique de Saint Roman, Atmel
  • Overview of ESA activities on FPGA technology   Presenter: David Merodio, ESA
  • FPGA 280K, 450K, modules   Presenter: Bernard Bancelin, Atmel
  • DARE180nm maintenance & DARE90nm development   Presenter: Geert Thys, IMEC
  • DARE (Design Against Radiation Effects) ESCC Evaluation, LEON3-DARE   Presenter: Pierre Somerlinck, Thales Alenia Space-ETCA
  • SUN-Sensor-on-a-Chip   Presenter: Werner Ogiers, CMOSIS
  • AT697FM (LEON2FT) & other Standard ASICs   Presenter: Bernard Bancelin, Atmel
  • MDPA ASIC (Multi-DSP/Micro-Processor Architecture)   Presenter: Tim Helfers, Astrium GmbH
  • SCOC3 (Spacecraft Controller On Chip) development environment   Presenter: Franck Koebel, EADS Astrium Velizy
  • Deep Space Transponder ASIC for BepiColombo   Presenter: David Joseph Fiore, Thales Alenia Space - Italia
  • Next Generation Multipurpose Microprocessor (NGMP)   Presenter: Jan Andersson, Aeroflex Gaisler
  • Digital Transparent Processor ASICs (CHAN , SWITCH)   Presenter: Emmanuel Liegeon, Thales Alenia Space - France
  • NGP-N ASIC (Next Generation Processor)   Presenter: Marc Childerhouse, Astrium UK
  • FFTC ASIC (Fast Fourier Transform Coprocessor)   Presenter: Timothy Pike, Astrium GmbH
     
     
    2nd Day - 31st of March 2010
     
  • High pin count ASIC package   Presenter: Dominique de Saint Roman, Atmel
  • Radiation Effects in Deep Submicron   Presenter: Pete Truscott, Qinetiq
  • Deep Sub-Micron ASIC technology & HSSL (KIPSAT)   Presenter: Laurent Dugoujon, ST Microelectronics
  • Low Power Broadband 1.5 GHz ADC   Presenter: Veronique Rozan, E2V
  • Low Power Broadband 1.5 GHz DAC   Presenter: Heinz-Volker Heyer, Kayser Threde
  • Essential Telemmetry Support ASIC   Presenter: Themis Karafasoulis, DUTH
  • Bank of Radiation Hardened ADCs   Presenter: Themis Karafasoulis, DUTH
  • HIFAS (Highly Integrated full-custom autocorrelation spectrometer ASIC)   Presenter: Anders Emrich, Omnisys
  • Pressure Sensor ASIC   Presenter: Themis Karafasoulis, DUTH
  • KNUT ASIC using DARE 180nm   Presenter: Dirk Thurnes, TESAT
  • Monolithic Galileo/GPS Front-End ASIC   Presenter: Mehdi Rostami, Synopsys
  • High Speed High Resolution ADC with BISC   Presenter: Bernardo Henriques, S3
  • High Resolution 24bit DAC   Presenter: Constantin Papadas, ISD
  • 80S32 Functional and performance validation   Presenter: Constantin Papadas, ISD
     
     
    3rd Day - 1st of April 2010
     
  • ESA IP Cores: present status and future   Presenter: Kostas Marinis, ESA
  • 1553 Databus ASICs and IP Core   Presenter: Marc Souyri, Astrium SAS
  • CANopen IP Core   Presenter: Giovanni Tuccio, CAEN Aurelia Space
  • Mass Memory Controller IP Core   Presenter: Pasquale Lombardi, Syderal
  • OCP-IP sockets / SPIRIT   Presenter: Aurelien Lefevre, Astrium SAS
  • Development of LEON SystemC Model   Presenter: Luca Fossati, Politecnico di Milano
  • HW/SW Co-simulation Platform   Presenter: Herald Michalik, IDA Braunschweig
  • SystemC IP Cores (SpW and CAN)   Presenter: Nkos Mouratidis, Qualtek
  • SpW IP in Atmel AT280K FPGA for BepiColombo SYMBIOSYS   Presenter: Vincent Carlier, IAS

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    Last edited 15 September 2010